China – September, 2011 - Dymek received EVG bonder and aligner order for MEMS from top semiconductor manufacturer in China.

EVG is the biggest advanced wafer level bonding supplier in the world. In MEMS field, 28 of the biggest 30 MEMS customers are using EVG equipment to make their product. EVG provides the full series equipment to support MEMS production, including Spin and Spray Coater · Double side Mask Aligner · Developer · Wafer Bonder · Bond Aligner · LT Plasma Activation · Temporary Bonder · Debonder · UV-NIL · Hot Embossing · µContact Printing
· R&D and HVM · manual and fully integrated and all up to 300mm

The installation has finished in Sep. 2011.