DYMEK Receives Purchase Order for EVG Wafer Bonder
Shanghai, China - September 2009 - EVG holds the dominant market share from manual to fully automated wafer bonders and has installation bases of more than 500 chambers.

Utilizing high-contact forces under elevated temperatures and a controlled atmosphere, this novel approach is today's process standard.

EVG Bonders can be widely used for manufacturing and R&D in many fields such as semiconductor, TSV, MEMS and advanced packaging.
 
DYMEK Company Ltd. Ⓒ 2018