Philippines – April 2010 - West•Bond model 7476D is a manual wedge-wedge wire bonder used to interconnect aluminum or gold wire leads to various semiconductor devices. Bonds are done by the wedge-wedge technique using ultrasonic energy to attach aluminum wire at room temperature and by adding work piece heat for gold wire. The machine can be easily converted to either the conventional 45 degree or 90 degree deep-access configuration via change of self-contained wire clamps to feed by angled or vertical method. Machine configuration and bond settings are controlled by microprocessor.

Since 1966, West•Bond has designed and manufactured a renowned line of wire bonding and die attach machines, wire pull and shear test equipment, ultrasonic components, and accessories for the microelectronics packaging industry.